Laser structuring of flexible circuit board
The UV laser device imported from Germany adopts UV-DPSS laser device,being able to process FPC structuring,FPC micropore drilling,FPC blind hole drilling,high polymer material cutting ,LTCC low temperature Co-fired ceramic circuit board cutting and drilling,application of high-precise component structuring and so on.
The technology application process is automatic during the whole process,owning the characteristic of being high-precise,high-efficient,high-quality,low carbon and environment friendly,setting a precedent in the innovation of UV laser application technology.
